Core i3-6006U

General Information

Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.

Cpu NameCore i3-6006U
SeriesIntel Core i3
Market segmentLaptop
DesignerIntel
Release date10 November 2016 (8 years ago)
Launch price (MSRP)$281

Performance & Rankings

Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.

Place in the ranking2272
Place by popularitynot in top-100
Power efficiency9.06

Architecture & Manufacturing

Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.

Architecture codenameSkylake (2015−2016)
Chip lithography14 nm
Die size98.57 mm2
Number of transistors1750 Million
64 bit support+

Cores & Threads

Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.

Physical cores2 (Dual-core)
Threads4
Number of CPUs in a configuration1 (Uniprocessor)

Clock Speeds

Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.

Base clock speed2 GHz
Boost clock speed2 GHz
Multiplier20

Cache Memory

Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.

L1 cache128 KB
L2 cache512 KB
L3 cache3 MB

Power & Thermal Characteristics

Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.

Power consumption (TDP)15 Watt
Maximum core temperature100 °C

Memory Support

Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.

Supported memory typesDDR3, DDR4
Maximum memory size32 GB
Maximum memory bandwidth34.134 GB/s

Interfaces & Expansion

Information about available interfaces for connecting peripheral devices and expansion capabilities.

SocketFCBGA1356
PCIe version3
PCI Express lanes12
Integrated graphics cardIntel HD Graphics 520

Technologies & Instructions

Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.

AES-NI+
AVX+
AMD-V+
Instruction set extensionsIntel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Enhanced SpeedStep (EIST)+
Speed Shift+
Turbo Boost Technology-
Hyper-Threading Technology+
TXT-
EDB+
SGXYes with Intel® ME