Core i3-7100H

General Information

Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.

Cpu NameCore i3-7100H
SeriesIntel Core i3
Market segmentLaptop
DesignerIntel
ManufacturerIntel
Release date3 January 2017 (8 years ago)
Launch price (MSRP)$393

Performance & Rankings

Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.

Place in the ranking1926
Place by popularitynot in top-100
Power efficiency5.85

Architecture & Manufacturing

Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.

Architecture codenameKaby Lake-H (2017)
Chip lithography14 nm
Die size126 mm2
64 bit support+

Cores & Threads

Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.

Physical cores2 (Dual-core)
Threads4
Number of CPUs in a configuration1 (Uniprocessor)

Clock Speeds

Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.

Base clock speed3 GHz
Boost clock speed2.8 GHz
Multiplier30

Cache Memory

Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.

L1 cache64K (per core)
L2 cache256K (per core)
L3 cache3 MB (shared)

Power & Thermal Characteristics

Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.

Power consumption (TDP)35 Watt
Maximum core temperature100 °C

Memory Support

Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.

Supported memory typesDDR4
Maximum memory size64 GB
Maximum memory bandwidth38.397 GB/s

Interfaces & Expansion

Information about available interfaces for connecting peripheral devices and expansion capabilities.

SocketFCBGA1440
PCIe version3
PCI Express lanes16
Integrated graphics cardIntel HD Graphics 630

Technologies & Instructions

Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.

AES-NI+
AVX+
AMD-V+
Instruction set extensionsIntel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Enhanced SpeedStep (EIST)+
Speed Shift+
Turbo Boost Technology-
Hyper-Threading Technology+
TXT-
EDB+
SGXYes with Intel® ME