Mobile Sempron 3300+
General Information
Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.
Cpu Name | Mobile Sempron 3300+ |
Series | AMD Mobile Sempron |
Market segment | Laptop |
Designer | AMD |
Release date | 1 June 2005 (19 years ago) |
Performance & Rankings
Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.
Place in the ranking | 3330 |
Place by popularity | not in top-100 |
Power efficiency | 0.28 |
Architecture & Manufacturing
Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.
Architecture codename | Roma (2005) |
Chip lithography | 90 nm |
64 bit support | - |
Cores & Threads
Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.
Physical cores | 1 (Single-Core) |
Threads | 1 |
Clock Speeds
Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.
Boost clock speed | 2 GHz |
Cache Memory
Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.
L2 cache | 128 KB |
Power & Thermal Characteristics
Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.
Power consumption (TDP) | 62/25 Watt |
Interfaces & Expansion
Information about available interfaces for connecting peripheral devices and expansion capabilities.
Socket | 745 |
Technologies & Instructions
Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.
Instruction set extensions | MMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit |