Mobile Sempron 3300+

General Information

Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.

Cpu NameMobile Sempron 3300+
SeriesAMD Mobile Sempron
Market segmentLaptop
DesignerAMD
Release date1 June 2005 (19 years ago)

Performance & Rankings

Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.

Place in the ranking3330
Place by popularitynot in top-100
Power efficiency0.28

Architecture & Manufacturing

Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.

Architecture codenameRoma (2005)
Chip lithography90 nm
64 bit support-

Cores & Threads

Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.

Physical cores1 (Single-Core)
Threads1

Clock Speeds

Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.

Boost clock speed2 GHz

Cache Memory

Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.

L2 cache128 KB

Power & Thermal Characteristics

Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.

Power consumption (TDP)62/25 Watt

Interfaces & Expansion

Information about available interfaces for connecting peripheral devices and expansion capabilities.

Socket745

Technologies & Instructions

Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.

Instruction set extensionsMMX, SSE, SSE2, SSE3 (Roma Core), Enhanced 3DNow!, NX bit