Ryzen 3 3250U

General Information

Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.

Cpu NameRyzen 3 3250U
SeriesAMD Ryzen 3
Market segmentLaptop
DesignerAMD
ManufacturerGlobalFoundries
Release date6 January 2020 (5 years ago)

Performance & Rankings

Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.

Place in the ranking1858
Place by popularitynot in top-100
Power efficiency15.05

Architecture & Manufacturing

Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.

Architecture codenamePicasso (2019−2022)
Chip lithography12 nm
Die size246 mm2
Number of transistors4500 Million
64 bit support+

Cores & Threads

Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.

Physical cores2 (Dual-core)
Threads4
Number of CPUs in a configuration1

Clock Speeds

Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.

Base clock speed2.6 GHz
Boost clock speed3.5 GHz
Multiplier26

Cache Memory

Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.

L1 cache128K (per core)
L2 cache512K (per core)
L3 cache4 MB (shared)

Power & Thermal Characteristics

Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.

Power consumption (TDP)15 Watt
Maximum core temperature95 °C

Memory Support

Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.

Supported memory typesDDR4
Maximum memory size32 GB
Maximum memory bandwidth38.397 GB/s

Interfaces & Expansion

Information about available interfaces for connecting peripheral devices and expansion capabilities.

SocketFP5
PCIe version3
PCI Express lanes12
Integrated graphics cardAMD Radeon RX Vega 3 ( - 1200 MHz)

Technologies & Instructions

Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.

AES-NI+
AVX+
Precision Boost 2+
AMD-V+
Instruction set extensionsMMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME