Ryzen 9 7945HX
General Information
Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.
| Cpu Name | Ryzen 9 7945HX |
| Market segment | Laptop |
| Designer | AMD |
| Manufacturer | TSMC |
| Release date | 4 January 2023 (2 years ago) |
Performance & Rankings
Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.
| Place in the ranking | 119 |
| Place by popularity | not in top-100 |
| Power efficiency | 59.52 |
Architecture & Manufacturing
Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.
| Architecture codename | Dragon Range-HX (Zen 4) (2023−2024) |
| Chip lithography | CCD = 5 nm, I/O = 6 nm |
| Die size | 2x 71 mm2 |
| Number of transistors | 13,140 million |
| 64 bit support | + |
Cores & Threads
Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.
| Physical cores | 16 (Hexadeca-Core) |
| Threads | 32 |
| Number of CPUs in a configuration | 1 |
Clock Speeds
Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.
| Base clock speed | 2.5 GHz |
| Boost clock speed | 5.4 GHz |
| Unlocked multiplier | + |
Cache Memory
Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.
| L1 cache | 64K (per core) |
| L2 cache | 1 MB (per core) |
| L3 cache | 64 MB (shared) |
Power & Thermal Characteristics
Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.
| Power consumption (TDP) | 55 Watt |
| Maximum core temperature | 100 °C |
Memory Support
Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.
| Supported memory types | DDR5 |
Interfaces & Expansion
Information about available interfaces for connecting peripheral devices and expansion capabilities.
| Socket | FL1 |
| PCIe version | 5 |
| PCI Express lanes | 28 |
| Integrated graphics card | AMD Radeon 610M (400 - 2200 MHz) |
Technologies & Instructions
Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.
| AES-NI | + |
| AVX | + |
| Precision Boost 2 | + |
| AMD-V | + |
| Instruction set extensions | MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME |