Xeon E5-1607 v2
General Information
Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.
| Cpu Name | Xeon E5-1607 v2 |
| Market segment | Server |
| Designer | Intel |
| Manufacturer | Intel |
| Release date | 10 September 2013 (11 years ago) |
Performance & Rankings
Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.
| Place in the ranking | 1792 |
| Place by popularity | not in top-100 |
| Power efficiency | 1.93 |
Architecture & Manufacturing
Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.
| Architecture codename | Ivy Bridge-E (2013) |
| Chip lithography | 22 nm |
| Die size | 257 mm2 |
| Number of transistors | 1,860 million |
| 64 bit support | + |
Cores & Threads
Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.
| Physical cores | 4 (Quad-Core) |
| Threads | 4 |
| Number of CPUs in a configuration | 1 |
Clock Speeds
Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.
| Base clock speed | 3 GHz |
| Boost clock speed | 3 GHz |
Cache Memory
Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.
| L1 cache | 64K (per core) |
| L2 cache | 256K (per core) |
| L3 cache | 10 MB (shared) |
Power & Thermal Characteristics
Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.
| Power consumption (TDP) | 130 Watt |
| Maximum case temperature (TCase) | 70 °C |
Memory Support
Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.
| Supported memory types | DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600 |
| Maximum memory size | 256 GB |
| Maximum memory bandwidth | 51.2 GB/s |
Interfaces & Expansion
Information about available interfaces for connecting peripheral devices and expansion capabilities.
| Socket | FCLGA2011 |
| PCIe version | 3 |
| PCI Express lanes | 40 |
Technologies & Instructions
Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.
| AES-NI | + |
| AVX | + |
| Instruction set extensions | Intel® AVX |
| vPro | + |
| Enhanced SpeedStep (EIST) | + |
| Turbo Boost Technology | - |
| Hyper-Threading Technology | - |
| TXT | + |
| EDB | + |