Xeon W-3175X
General Information
Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.
| Cpu Name | Xeon W-3175X |
| Series | Intel Xeon W |
| Market segment | Server |
| Designer | Intel |
| Manufacturer | Intel |
| Release date | 19 December 2018 (6 years ago) |
| Launch price (MSRP) | $2,999 |
Performance & Rankings
Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.
| Place in the ranking | 176 |
| Place by popularity | not in top-100 |
| Cost-effectiveness evaluation | 17.57 |
| Power efficiency | 10.7 |
Architecture & Manufacturing
Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.
| Architecture codename | Skylake (server) (2017−2018) |
| Chip lithography | 14 nm |
| Number of transistors | 8,000 million |
| 64 bit support | + |
Cores & Threads
Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.
| Physical cores | 28 (Octacosa-Core) |
| Threads | 56 |
| Number of CPUs in a configuration | 1 (Uniprocessor) |
Clock Speeds
Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.
| Base clock speed | 3.1 GHz |
| Boost clock speed | 3.8 GHz |
| Multiplier | 31 |
| Unlocked multiplier | + |
Cache Memory
Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.
| L1 cache | 64K (per core) |
| L2 cache | 1 MB (per core) |
| L3 cache | 38.5 MB (shared) |
Power & Thermal Characteristics
Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.
| Power consumption (TDP) | 255 Watt |
| Maximum core temperature | 85 °C |
Memory Support
Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.
| Supported memory types | DDR4-2666 |
| Maximum memory size | 512 GB |
| Maximum memory bandwidth | 128.001 GB/s |
Interfaces & Expansion
Information about available interfaces for connecting peripheral devices and expansion capabilities.
| Socket | FCLGA3647 |
| PCIe version | 3 |
| PCI Express lanes | 48 |
Technologies & Instructions
Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.
| AES-NI | + |
| AVX | + |
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 |
| vPro | + |
| Enhanced SpeedStep (EIST) | + |
| Speed Shift | + |
| Turbo Boost Technology | 2 |
| Hyper-Threading Technology | + |
| TSX | + |
| TXT | + |
| EDB | + |