Xeon X5550
General Information
Core specifications including model name, series, manufacturer, and market segment. This section provides essential identification details for the processor model.
| Cpu Name | Xeon X5550 |
| Market segment | Server |
| Designer | Intel |
| Manufacturer | Intel |
| Release date | 30 March 2009 (16 years ago) |
| Launch price (MSRP) | $62 |
Performance & Rankings
Processor evaluation across various parameters, including position in performance rankings, user popularity, and price-to-performance ratio metrics.
| Place in the ranking | 2039 |
| Place by popularity | not in top-100 |
| Cost-effectiveness evaluation | 0.32 |
| Power efficiency | 1.9 |
Architecture & Manufacturing
Technical specifications including architecture codename, manufacturing process, die size, and transistor count that define the processor's technological foundation.
| Architecture codename | Gainestown (2009−2010) |
| Chip lithography | 45 nm |
| Die size | 263 mm2 |
| Number of transistors | 731 million |
| 64 bit support | + |
Cores & Threads
Information about physical and logical cores that determine the processor's capabilities for parallel computing and multitasking performance.
| Physical cores | 4 (Quad-Core) |
| Threads | 8 |
| Number of CPUs in a configuration | 2 |
Clock Speeds
Operating frequencies including base and boost clock speeds that directly affect the processor's performance and execution speed.
| Base clock speed | 2.66 GHz |
| Boost clock speed | 3.06 GHz |
Cache Memory
Fast access memory capacity across different levels that significantly impacts data access speed and overall processor performance.
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 8 MB (shared) |
Power & Thermal Characteristics
Heat output and energy consumption information, critical for selecting appropriate cooling systems and power supplies.
| Power consumption (TDP) | 95 Watt |
| Maximum core temperature | 75 °C |
Memory Support
Specifications for supported RAM, including types, maximum capacity, and bandwidth capabilities.
| Supported memory types | DDR3 |
| Maximum memory size | 144 GB |
| Maximum memory bandwidth | 32 GB/s |
Interfaces & Expansion
Information about available interfaces for connecting peripheral devices and expansion capabilities.
| Socket | FCLGA1366,PLGA1366 |
| PCIe version | 2 |
Technologies & Instructions
Special instruction sets and technologies that extend the processor's capabilities for specific tasks and performance optimization.
| Enhanced SpeedStep (EIST) | + |
| Turbo Boost Technology | 1 |
| Hyper-Threading Technology | + |
| TXT | + |
| EDB | + |